IPS Assembly inspects at every stage of the assembly process rather than only at the end: 3D solder paste inspection after printing, 3D automated optical inspection after reflow, X-ray for BGAs and bottom-terminated components, and in-circuit or functional test to your procedure before shipment. Inspection is to IPC-A-610 Class 2 or Class 3 as called out on your drawing, performed by IPC-certified staff.
(Paste volume, placement, solder joint measurement)
(BGA, QFN, hidden and voided joints)
(Your fixture or ours, documented results)
2D inspection sees shape; 3D inspection measures height and volume. That is the difference between spotting a bridge and measuring whether a joint has enough solder to survive vibration. Our 3D SPI catches paste problems before parts are placed, and 3D AOI measures position, height and solder fillet on every component after reflow. Read why 3D AOI capability matters and advanced PCB inspection with 3D SPI, AOI and X-ray.
The class on your drawing sets the acceptance criteria we inspect to. Class 2 is the default for most industrial and automotive electronics; Class 3 applies where failure is not an option — defense, aerospace and life-critical products — and changes solder fill, void and placement limits on the floor. We inspect to the class specified and can advise if a drawing is silent. See IPC-A-610 Class 2 vs Class 3 and why first article testing is more than a checkbox.
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