Building Tomorrow’s Workforce: Manufacturing Day 2026 at IPS Assembly
This week, IPS Assembly proudly participated in Manufacturing Day 2026, opening our doors to students from Melvindale High School for a hands-on look inside electronics contract manufacturing. Manufacturing Day, celebrated nationwide each October, is about sparking curiosity and helping the next generation explore careers in modern manufacturing. For the second year running, IPS used the […]
Why 3D AOI Capability Matters in PCB Assembly
3D AOI catches what repetitive manual inspection misses at volume. Here’s what our system measures, how it’s taught from a master board, and why our IPC-certified inspectors still inspect every job.
Moving a PCB Assembly Onshore? Here’s the Transfer Process We Run at IPS
A transfer is a project, not a PO. More buyers are asking what it takes to move an overseas board build to the U.S. — here’s the five-step process we run on our Livonia floor, from the data package audit to first article, and the mistakes that make transfers hurt.
Class 2 or Class 3? What That Line on Your Drawing Actually Buys You
“Build to IPC-A-610” with no class is like ordering steel without a grade. Here’s what Class 2 vs. Class 3 actually changes on our floor, what it costs, and how to spec it right – plus why “Class 3 certified shop” isn’t a real thing.
IPS Assembly Joins the National Advanced Mobility Consortium (NAMC)
IPS Assembly Corp joins NAMC — the National Advanced Mobility Consortium — expanding our defense manufacturing capabilities into DoD ground vehicle and advanced mobility programs. Proud to serve the Warfighter from Livonia, Michigan.
Why THT Assembly Still Matters in an SMT World
Surface-mount technology dominates modern PCB assembly, but through-hole technology still plays an important role in rugged, connector-heavy, high-current, and long-life electronics. This IPS Insights article explains why THT assembly remains relevant for industrial, defense, automotive, and mixed-technology builds.
Build-to-Print Manufacturing: Where Production Begins and Engineering Support Starts
Build-to-print manufacturing works best when the customer provides a complete, controlled documentation package ready for production. When drawings, BOMs, test requirements, or design details are incomplete, engineering support or NRE may be needed to bridge the gap between concept and repeatable manufacturing.
Prototype Quantities: 1, 5, or 25: What’s Best for Electronics Builds?
Choosing the right prototype quantity can reduce risk, speed validation, and prevent costly redesigns. Here’s how to decide between 1, 5, or 25 units for electronics builds.
Continuing to Invest in SMT Capabilities at IPS Assembly
IPS Assembly continues to invest in advanced SMT capabilities, integrating new pick-and-place machines, expanding programming depth, and maintaining open capacity to onboard new customers quickly at any volume.
The Gap Between a “Correct” BOM and a Buildable One
A Bill of Materials can be technically correct and still create delays in production. This article explains the gap between a “correct” BOM and one that’s truly buildable—and how manufacturing realities shape the difference.