Our Capabilities

At IPS Assembly, we have a range of capabilities to meet your PCB assembly and testing needs:

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Surface Mount Technology (SMT)

Thru-Hole Technology (THT)

Double Side + Intrusive Reflow Process

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Mixed Technology

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Fine Pitch Components

Flexible Turn Times

BGA & micro-BGA Chip Scale Packaging

Soldering Types

Advanced Inventory Management

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Full Turn Key – Kitted Assemblies

Box Build

Testing