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Our Capabilities
At IPS Assembly, we have a range of capabilities to meet your PCB assembly and testing needs:
Surface Mount Technology (SMT)
Thru-Hole Technology (THT)
Double Side + Intrusive Reflow Process
Mixed Technology
Fine Pitch Components
Flexible Turn Times
BGA & micro-BGA Chip Scale Packaging
Soldering Types
Advanced Inventory Management
Full Turn Key – Kitted Assemblies
Box Build
Testing