Our Capabilities

At IPS Assembly, we have a range of capabilities to meet your PCB assembly and testing needs:

Surface Mount Technology (SMT)

Thru-Hole Technology (THT)

Double Side + Intrusive Reflow Process

Mixed Technology

Fine Pitch Components

Flexible Turn Times

BGA & micro-BGA Chip Scale Packaging

Soldering Types

Advanced Inventory Management

Full Turn Key – Kitted Assemblies

Box Build