Electronics Manufacturing Capabilities & Equipment

IPS Assembly Capabilities

At IPS Assembly, we have a range of capabilities to meet your PCB assembly and testing needs:

Surface Mount Technology (SMT)

Thru-Hole Technology (THT)

Double Side + Intrusive Reflow Process

Advanced Inventory Management

BGA & micro-BGA Chip Scale Packaging

Full Turn Key – Kitted Assemblies

Fine Pitch Components

Soldering Types

Box Build

Flexible Turn Times

Mixed Technology

Testing

Reverse Engineering

Advanced Inventory Management